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SP Series Phase Change Thermal Interface Material

SP Series Phase Change Thermal Interface Material
company Dongguan SHEEN Electronic Technology Co.,Ltd,
Categories Plastic Rolling Machinery
Update2011-03-14
Original RegionChina
SP Series Phase Change Thermal Interface Material
SP Series Phase Change ThermalInterface Material
SP Series materials are polymers that reinforce heat andfeatured by phase transformation. In room temperature, SPseries materials are solid and easy to process. However, inoperating temperature when the states of the component materialsare about to change,SP series materials quickly get softenedand melted so as to completely fill the gaps between the heatdissipation elements and the electronic components with highlyefficient heat conduction.
Features
Proprietarytechnology prevents excessive pump-out after initial heatcycle
With naturallytacky and requires no adhesive coating or heat sink preheatfor attachment
Low thermalresistance at low pressures
It is suppliedthe in rolls with a top tabbed liner for easy manual or largevolume automated
Applications
Highfrequency microprocessors
Notebook anddesktop PCs
Computer servers
Thermal teststands
DC/DC Converts
Memory modules
Cache chipsIGBTs

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