SP Series Phase Change ThermalInterface Material SP Series materials are polymers that reinforce heat andfeatured by
phase transformation. In room temperature, SPseries materials are
solid and easy to process. However, inoperating temperature when
the states of the component materialsare about to change,SP series
materials quickly get softenedand melted so as to completely fill
the gaps between the heatdissipation elements and the electronic
components with highlyefficient heat conduction. Features Proprietarytechnology prevents excessive pump-out after initial
heatcycle With naturallytacky and requires no adhesive coating or heat sink
preheatfor attachment Low thermalresistance at low pressures It is suppliedthe in rolls with a top tabbed liner for easy manual
or largevolume automated Applications Highfrequency microprocessors Notebook anddesktop PCs Computer servers Thermal teststands DC/DC Converts Memory modules Cache chipsIGBTs